Samsung’s upcoming Galaxy S26 lineup appears to be heading for a significant slimdown. The base model could measure just 6.9mm thick, while the Ultra model drops to 7.9mm. All three models would be thinner and lighter than their iPhone 17 counterparts.
ifm has introduced the SU Puresonic Hygienic ultrasonic sensor specifically designed for food, pharmaceutical, and water treatment applications. The sensor features a seal-free stainless steel design and operates across a wide temperature range from -40°C to +120°C.
Intel is pushing early Linux graphics support for its upcoming Nova Lake processors while addressing security vulnerabilities. The company published 30 new security advisories alongside microcode updates for current CPUs.
Apple is reportedly developing a new budget MacBook that could sell for under $999 and use iPhone A18 Pro chips. Analyst Ming-Chi Kuo predicts 5-7 million units in 2026, potentially making up 20% of Mac sales. The device aims to convert would-be iPad buyers to laptops.
Samsung has quietly launched the Galaxy Book 5 Edge with built-in 5G connectivity. The laptop features a Snapdragon X processor and claims up to 27 hours of battery life.
Valve’s Steam Machine announcement left out the most crucial detail: price. With specs comparable to gaming laptops and mini-PCs, the final cost could determine whether this PC-alternative succeeds or fails. Here’s what the hardware and business strategy suggest about where pricing will land.
Chinese tech giant Baidu is making a major play in the AI hardware space with custom chips designed to compete with Nvidia. The company plans rack-scale systems with 256 and 512 accelerators starting in 2026, alongside a new training chip for trillion-parameter models.
A key Linux developer has joined Qualcomm, signaling potential challenges for x86_64 laptops. Meanwhile, Linux 6.19 is adding more Arm graphics hardware support. The timing suggests a coordinated push toward Arm-based Linux computing.
Microsoft’s Azure HBv5 instances have reached general availability featuring AMD’s custom EPYC 9V64H processors with HBM3 memory. The new instances offer up to 368 vCPUs and deliver staggering 6.7 TB/s memory bandwidth for HPC applications. Performance benchmarks show dramatic evolution from 2019’s
Samsung’s ambitious Galaxy Z TriFold appears to be nearly ready for launch with detailed specs now leaking. The device will feature triple folding panels, a 200MP camera, and premium pricing that puts it in a category of its own. Production will be extremely limited to just 50,000 units globally.
