Tower Semiconductor is expanding its proven 300mm wafer bonding technology beyond image sensors to silicon photonics and SiGe BiCMOS processes. The move enables heterogeneous 3D-IC integration for data center applications. Cadence design tools now support the multi-technology platform.
Samsung’s upcoming Exynos 1680 chipset for the Galaxy A57 has appeared on Geekbench with surprising specifications. The chip features AMD’s latest RDNA 3.5 graphics architecture, which could significantly boost gaming performance in mid-range devices.
AI is fundamentally reshaping chip design, with advanced packaging becoming critical for performance. Foundries like TSMC, Intel and Samsung are expanding into packaging while traditional assemblers scale up. The technology could triple package sizes by 2030 to accommodate more memory and computing
The Chinese government is reportedly intervening in how SMIC allocates its chip production, prioritizing Huawei amid ongoing US export restrictions. This represents a significant escalation in the tech cold war between the two superpowers.
NVIDIA’s Jensen Huang admits it would be “foolish” to underestimate Huawei’s rapid AI advancements. The Chinese tech giant plans competitive AI chips through 2027 and claims its Atlas SuperPoDs can match NVIDIA’s Rubin performance. With NVIDIA locked out of China, Huawei is gaining ground fast.
SoftBank has completely exited its Nvidia position, selling 32.1 million shares for $5.83 billion. The Japanese conglomerate is redirecting these funds toward what it calls a “large” investment in OpenAI, potentially exceeding $30 billion.
TSMC’s 3nm chip production capacity will nearly max out by 2026 despite aggressive conversion of older production lines. Customers are paying massive “hot run” premiums of 50-100% above normal prices, driving TSMC’s gross margins above 60%. The capacity crunch comes as NVIDIA pushes for even more pr
Intel’s chief technology and AI officer Sachin Katti is departing the company after just six months in the role. He’s joining OpenAI to work on compute infrastructure for artificial general intelligence. The move comes as Intel struggles to compete in the AI accelerator market.
Adeia has filed a patent lawsuit against AMD over hybrid bonding methods used in 3D V-Cache processors. The case involves ten patents covering chip-stacking techniques that enable high-bandwidth cache connections. AMD has not yet commented on the allegations.
AMD reported a massive 36% revenue jump and beat earnings estimates, but its margin forecast for the next quarter is just in line with what analysts expected. The stock slipped after hours, showing that even in an AI boom, investors want more than just good numbers.
