Researchers have synthesized a complex molecular catenane with globally delocalized electrons. This breakthrough reveals unprecedented through-space electronic interactions that could transform materials science.
American electronic waste is flooding Southeast Asian nations, bypassing international treaties and local laws, a new investigation shows. The hidden trade, valued at over $1 billion, exposes workers to toxic conditions and strains regional environments.
A recent investigation by the environmental watchdog Basel Action Network (BAN) has uncovered that millions of tons of discarded electronics from the United States are being shipped to Southeast Asia, creating what sources describe as a “hidden tsunami” of toxic waste. According to the report, at least 10 US companies are involved in exporting used electronics, often to countries ill-equipped to handle hazardous materials safely.
The Invisible Trade: America’s Electronic Waste Pipeline A comprehensive two-year investigation has uncovered a massive flow of electronic waste from…
Major Funding Round Fuels European Expansion Austrian recommerce marketplace refurbed has successfully closed a €50 million funding round to accelerate…
European automotive manufacturers are activating emergency response protocols as China moves to restrict exports from chipmaker Nexperia. Industry leaders warn of potential production halts reminiscent of the 2021 semiconductor crisis, with companies establishing task forces and daily supply chain assessments.
European carmakers are reportedly deploying strategies similar to those used during the COVID-19 pandemic as they prepare for potential semiconductor shortages. This development comes after China moved to restrict outbound shipments from Nexperia, a crucial chipmaker for the automotive industry that operates under Chinese ownership.
Researchers have created a groundbreaking chip with 41 vertical layers that sidesteps traditional scaling limitations. The new architecture reportedly offers similar performance to conventional chips while potentially reducing the electronics industry’s carbon footprint.
As chip manufacturers approach physical limits of miniaturization, researchers have demonstrated a revolutionary approach: building upward rather than shrinking components further. According to reports from the King Abdullah University of Science and Technology, a team led by Xiaohang Li has developed a record-breaking chip with 41 vertical layers of semiconductors, creating a transistor stack approximately 10 times taller than any previously manufactured.
